Product introducionSD-800 BGA Rework
StationFeatures:1. The integration design of hot air head and
mounting head, with automatic mounting automatic welding and
automatic removal function.2. The upper air head adopts hot air
system, heating up fast, temperature uniformity, cooling fast (can
suddenly drop 50-80 degrees when cooling down), to better meet the
process requirements of lead-free welding. Lower heat temperature
zone are using infrared + hot air mixed heating, infrared direct
action on the heating area, and hot air conduction at the same
time, which can make up for the mutual shortcomings, so that the
PCB heating fast (heating rate of 10 ºC / S), while still
maintaining a uniform temperature;.3. Independent three temperature
zones (upper temperature zone, lower temperature zone, infrared
preheating zone), the upper temperature zone and lower temperature
zone to achieve synchronous automatic movement, can automatically
reach the bottom of the infrared preheating zone in any position.
The lower temperature zone can be moved up and down to support the
PCB, which is automatically controlled by motor. To realize the PCB
in the fixture does not move, the upper and lower heating head can
move to the target chip of the PCB in one piece.4. PCB cardboard
adopts high precision slider to ensure the accuracy of BGA and PCB
board placement;5. The original bottom preheating platform, using
Germany imported excellent heating materials (infrared gold-plated
light tube) + anti-dazzle constant temperature glass (temperature
resistance up to 1800 ºC) preheating area of 500 * 420mm;6.
Preheating platform, plywood device and cooling system can be moved
in X direction as a whole. PCB positioning, folding and welding
safer and more convenient.7. X, Y using automatic motor control of
movement, so that alignment is fast and convenient, equipment space
is fully utilized, with a relatively small equipment volume to
achieve a large area of PCB rework, the maximum clamping board size
up to 510 * 480mm, no rework dead space.8. Double rocker control,
alignment lens and upper and lower heating platform, thus ensuring
alignment accuracy.9. Built-in vacuum pump, φ angle rotation,
precision fine-tuning placement nozzle.10. Automatic nozzle
recognition suction material and mounting height, pressure can be
controlled within 10 grams tiny range, with 0 pressure suction
material, mounting function, for smaller chips.11. Color optical
vision system with manual X, Y direction movement, with dichroic,
magnification and fine-tuning function, including chromatic
aberration resolution device, auto-focus, software operation
function, can rework maximum BGA size 80*80 mm.12. A variety
of sizes of alloy hot air nozzle, easy to replace, can be rotated
360 ° positioning.13. Equipped with 5 temperature measurement
ports, with multi-point real-time temperature monitoring and
analysis function.14. With solid-state operation display function,
so that the temperature control is more safe and reliable.15. The
machine can automatically generate SMT standard temperature
disassembly curve in different regions under different
environmental temperatures, without manual setting of the machine
curve, experienced operators can use, to achieve machine
intelligence.16. With a camera to observe the melting point of the
side of the tin ball, easy to determine the curve (this function is
optional). Product Parameters Technical
Parameters:Total power7600WUpper heating
power1200WLower heating power1200WInfrared heating power5000W
(2000W controlled)Power SupplyTwo-phase 220V, 50/60HzPositioning
methodV-shaped slot to fix PCB, laser positioning lamp for quick
positioning, motor can be operated by rocker to move X, Y axis at
will.The number of drive motors and control area6 (split edge
control equipment heating head X, Y-axis movement, alignment lens
X, Y-axis movement, the second temperature zone heating head Z1
electric lift, the upper heating head Z-axis up and down
movement.Whether the upper and lower heating heads can be moved as
a wholeYes (motorized movement)Whether the alignment lens can be
automaticallyYes (automatic movement or manually controlled
movement)Whether the equipment with suction feeding deviceYes
(standard)The third temperature zone heating (preheating) modeThe
use of German imports of infrared heating light tube (advantage:
heating fast, the equipment is normally heated, the temperature
around the PCB main board and the temperature of the reworked chip
position will not form a large temperature difference, to ensure
that the PCB main board will not be deformed or distorted
phenomenon, can better improve the chip welding yield)The second
temperature zone control modeElectric automatic liftingTemperature
controlHigh-precision K-type thermocouple (K-sensor) closed-loop
control (Closed Loop), the upper and lower independent temperature
measurement, temperature control accuracy of ± 1 degree.Electrical
optionsTaiwan touch screen + high precision t
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