Bench-Top CNC Double Side Lapping Grinding Machine

Bench-Top Double Side Lapping / Polishing Machine for Max. 2" wafer - EQ-Unipol-160DEQ-UNIPOL-160D machine is a bench-top precision double side lapping and polishing machine. It can lap and polish 4 pieces of wafers up to 2" in both side at the same time, and achieves TTV less than one micron in 2" diameter area. It is an idea tool to prepare Si, Ge and oxide single crystal wafer with 2" diameter or less in the laboratory.  Lapping Plate Dimensions225 x  94 x 15mm (Outer dia. x Arbor dia. x Thickness)Weight of Upper Lapping Plate and Balance5.5kg (3kg for balance weight)Gearing Template Specificationz=54 m=1.5  dia.81mm (metric)Number of Gearing Templates for Simultaneous Use4Largest Work Piece SizeDia. 60mm; thickness 15mmAccuracy of Fatness and Parallelism0.001mmAccuracy of Lapping and Polishing+/-0.001mmSurface Finish> grade 10Input PowerSingle phase 220VMotorDC/600WDimensions615x375x494mmNet Weight80kgNoteFour pieces of gearing templates are required for double sides polishing. One template can hold sample as the follows:One 60 mm or 2" diameter wafer3 pcs or less 1" diameter wafer14 pcs or less 10x10mm substrate To get a quote for gearing template please let us know wafer size and final thickness to be polished.ComplianceCE CertifiedWarrantyOne year limited warranty with lifetime support  /* March 10, 2023 17:59:20 */!function(){function s(e,r){var a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1