Finest Group was established in April 2003, focusing on PCB board
manufacturing, SMT processing, and components support
services.FINEST PCB Assemble Ltd is a subsidiary of FINEST Group.
It was established on April 2019, specializing in EMS Processing,
SMT quick-turn prototype, and small batch production. Finest PCBA
team with the ability to select materials, make samples and small
batch production, and donging testing services. We always improve
research and development efficiency, aiming at providing fast
service to satisfy customers' different demands for PCB
assembly.The SMT factory is located in Fuyong, Shenzhen, with a
plant area of 2500m'and8 SMT production lines. Equipped with new
imported Hanwha 471, 481, 482, automatic solder paste printers,
ten-temperature zone reflow soldering, wave soldering, and other
high-tech equipment. Besides, factories also have advanced. AOI,
X-RAY, SPI, intelligent first article tester, BGA rework station,
etc. Factories develop the newest technology and invest in the best
equipment to improve our production ability and focus on R&D,
prototyping, small batch SMT assembly, and other services.We have a
series of resistors and capacitors and common inductances, magnetic
beads. connectors, crystal oscillators, and diode triodes, and
provide full BOM component supporting services for research and
development.FINEST PCB factory is located in Humen, Dongguan. We
are a high-tech enterprise, with first-class processing equipment,
that focuses on single-side, double-sided, and multi-layer PCB
manufacturing. One-stop PCB and PCB assembly, components, SMT & EMS
services, with fast delivery time, good quality, and best
communication support.Process Capability:PCB, Flexible PCB, FPC
flexible board process capability parametersProduct Type:
Single-layer board, double-layer board, layered board, hollow
board, multi-layer board, rigid-flexible board, PCB circuit
board, PCBA,PET transparent boardLayers: 1-16 Layers of
Flexible Circuit Boards, 2-16 Layers of Rigid-Flexible Boards,
1-32 Layers of PCB boardsThickness: Flexible circuit board:
0.06-0.4mm, rigid-flexible board: 0.25-6.0mm, PCB:
0.4-3.5mmThickness Tolerance: ±0.03mmCopper foil thickness:12um,
18um, 35um, 70umMinimum line width and line spacing:
0.05mm/2milMinimum Drilling: CNC: 0.15mm, Laser: 0.1mmMin.
PAD: 0.3MMSheet Material: PI (polyimide), PET, electrolytic
copper, rolled copper, FR4, copper-clad
laminateFiberboardInsulation Thickness: Flexible Circuit
Board:12.5um,25um,50umSolder Mask: Flexible circuit board: yellow,
white, black.PCB: photosensitive ink, white, black, blue, green,
yellow, redReinforcement: FR4/PI/PET/SUS/PSASurface treatment:
Immersion gold, immersion silver, electroplating gold, tin plating,
OSP, HASL, carbon oilImpedance control:50Ω-120ΩImpedance Control
Tolerance:±10%PCBMinimum Grooving Cutter:0.6mmTrace and Outline
Spacing:≥0.25mm(10mil)Half-hole process: Minimum half-hole diameter
0.5mmPeel Strength:≥2.0N/CMFlame Retardant:94V-0Solder Bridge:≥4mil
(green oil bridge 0.1mm, variegated oil: 0.12mm, black oil, white
oil: 0.15mmWhy choose Finest PCB Assembly? 1. More than 19 years
experience of in electronic manufacturing services for PCB making.
2. One-stop service | PCB Manufacturing | Components sourcing and
PCB assembly one-stop PCBA service to help you easily achieve your
electronic products. 3. More than 1000 customers working with us
for telecom, IOT, RF, smart control, security, medical, industrial,
automotive, 3G / 4G / 5G products. 4. Reasonable and stable price:
have established a strong global electronics components supply
chain that helps us getreasonable and stable price 5. Quality
assurance: more than 15 years of experience in the engineering team
and quality control team to ensureall products come out under
control.6. Professional replace-solution: help customers source
professional replace-solution to achieve faster, lower cost with
high-quality components purchasing agent service. PCBA
Technical Capability 1. Assembly Type:: FR4, FPC, Rigid-flex
PCB, Metal base PCB. 2. Assembly Specification: Min size L50*W50mm;
Max size: L510*460mm 3. Assembly thickness: Min thickness: 0.2mm;
Max thickness: 3.0mm 4. Components Specification Components
DIP: 01005Chip/0.35 Pitch BGA Minimum device accuracy: +/-0.04mm
Minimum footprint distance: 0.3mm 5. File format: BOM list; PCB
Gerber file: 6. Test IQC: Incoming inspection IPQC:
Production inspection; first ICR test Visual QC: Regularly quality
inspection SPI test : Automatic solder paste optical inspection
AOI: SMD component welding detection, components shortage &
component polarity detection X-Ravd: BGA test; QFN and other
precision devices hidden PAD device inspection Function test: Test
function and performance according to the customer's test
procedures and steps 7. Reworking: BGA rework equipment 8. Delivery
Time Normal delivery time: 24 hours( fastest 12 hours
quick-turn) Small production: 72 hou
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