Integrated circuit black ceramic low-temperature glass double row
narrow body base Black ceramic low-temperature glass packaging is a
technology that uses low melting point glass and black alumina
ceramic as materials to package and protect IC chips. Black ceramic
is an ideal material for various chip packaging, with good
mechanical, electrical, and chemical properties. The packaging
process is simple, the price is low, and the reliability is high.
Suitable for mass production and widely used in military and
civilian high reliability products, it has broad market prospects
and development space. /* January 22, 2024 19:08:37
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a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1
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