Professional Immersion Gold PCB Assembly Multi Layer Printed Circuit Board Bluetooth Module

Production Ability For PCBLayer:1-40 layerSurface:HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect.Copper thickness:0.25 Oz -12 OzMaterial:FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum  BT,RogersBoard thickness0.1 to 6.0mm(4 to 240mil)Minimum line width/space0.076/0.076mmMinimum line gap+/-10% Outer layer copper thickness140um(bulk)  210um(pcb prototype)Inner layer copper thickness70um(bulk) 150um(pcb protytype)Min.finished hole size(Mechanical)0.15mmMin.finished hole size (laser hole)0.1mmAspect ratio10:01(bulk)  13:01(pcb prototype)Solder Mask ColorGreen,Blue,Black,White,Yellow,Red,GreyTolerance of dimension size+/-0.1mm Tolerance of board thickness