Multilayer HDI Ccl Printed Circuit Board Custom HDI Printed Circuit Board Manufacturing China Supplier

HDI PCB Boards Sucessful Cases Show-DefinitionHDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than employed in conventional PCB technology. HDI PCBs are made through microvias, buried vias and sequential lamination with insulation materials and conductor wiring for higher density of routing.-ApplicationsHDI PCB is used to reduce size and weight, as well as to enhance electrical performance of the device. HDI PCB is the best alternative to high layer-count and expensive standard laminate or sequentially laminated boards. HDI incorporate blind and buried vias that help to save PCB real estate by allowing features and lines to be designed above or below them without making a connection. Many of today's fine pitch BGA and flip-chip component footprints do not allow for running traces between the BGA pads. Blind and buried vias will only connect layers requiring connections in that area.PCB CapabilitiesRigid PCB Manufacturing Capacity ABIS experienced in making special materials for rigid PCB, such as: CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc. Below is a brief overview FYI.  ItemSpeci.Layers1~20Board Thickness0.1mm-8.0mmMaterialFR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etcMax Panel Size600mm×1200mmMin Hole Size0.1mmMin Line Width/Space3mil(0.075mm)Board Outline Tolerance+_0.10mmInsulation Layer Thickness0.075mm--5.00mmOut Layer Copper Thickness18um--350umDrilling Hole (Mechanical)17um--175umFinish Hole (Mechanical)0.10mm--6.30mmDiameter Tolerance (Mechanical)0.05mmRegistration (Mechanical)0.075mmAspect Ratio16:1Solder Mask TypeLPISMT Mini. Solder Mask Width0.075mmMini. Solder Mask Clearance0.05mmPlug Hole Diameter0.25mm--0.60mmImpedance Control Tolerance+_10%Surface finishENIG, OSP, HASL, Chem. Tin/Sn, Flash GoldSoldermaskGreen/Yellow/Black/White/Red/BlueSilkscreenRed/Yellow/Black/WhiteCertificateUL, ISO 9001, ISO14001, IATF16949 Special RequestBlind hole, Gold finger, BGA, Carbon ink, peekable mask, VIP process, Edge plating, Half holesMaterial SuppilersShengyi, ITEQ, Taiyo, etc.Common PackageVacuum+Carton Lead TimePCB Lead Time CategoryQ/T Lead timeStandard Lead TimeMass Production Double Sided24hrs3-4 working days8-15 working days 4 Layers48hrs3-5 working days10-15 working days 6 Layers72hrs3-6 working days10-15 working days 8 Layers96hrs3-7 working days14-18 working days 10 Layers120hrs3-8 working days14-18 working days 12 Layers120hrs3-9 working days20-26 working days 14 Layers144hrs3-10 working days20-26 working days 16-20 LayersDepends on the specific requirements 20+ LayersDepends on the specific requirementsOur AdvantagesHigh-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hourHigh efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productionProfessional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III StandardsWe provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.     Quality ControlQuality Control-Advanced equipment listAOI TestingChecks for solder pasteChecks for components down to 0201Checks for missing components, offset, incorrect parts, polarityX-Ray InspectionX-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.Power-up TestAdvanced Function TestFlash Device ProgrammingFunctional testing IOC incoming inspectionSPI solder paste inspectionOnline AOI inspectionSMT first article inspectionExternal assessmentX-RAY-welding inspectionBGA device reworkQA inspectionAnti-static warehousing and shipment-Persue 0% complaint on qualityAll department implements according to ISO and the related dept has to provide 8D report if any board scrapped to defective.All the outgoing boards have to be 100% electronic tested, impedance tested and soldering.Visual inspected, we make the inspect microsection before shipment.Train the mindset of employees and our enterprise culture, make they happy with their work and our company, it's helpful for them to produce good quality products.High quality raw material (Shengyi F