Enig Polymide Flexible Board FPCB Manufacturing FPC with ISO with Us UL

Flexible Printed Circuits Boards Custom  PCB CapabilitiesABIS Flexible PCB Manufacturing Capacity ItemSpeci.Layers1~8Board Thickness0.1mm-0.2mmSubstrate Material PI(0.5mil,1mil,2mil),PET(0.5mil,1mil)Conductive MediumCopper foil(1/3oz,1/2oz,1oz,2oz)ConstantanSilver PasteCopper InkMax Panel Size600mm×1200mmMin Hole Size0.1mmMin Line Width/Space3mil(0.075mm) Maximum imposition size (single & double panel) 610mm*1200mm(Exposure limit) 250mm*35mm(only develop test samples) Maximum imposition size (single panel & double panel no PTH self-drying ink + UV light solid) 610*1650mmDrilling Hole (Mechanical)17um--175umFinish Hole (Mechanical)0.10mm--6.30mmDiameter Tolerance (Mechanical)0.05mmRegistration (Mechanical)0.075mmAspect Ratio2:1(Minimum aperture 0.1mm)5:1(Minimum aperture 0.2mm)8:1(Minimum aperture 0.3mm)SMT Mini. Solder Mask Width0.075mmMini. Solder Mask Clearance0.05mmImpedance Control Tolerance+-0%Surface finishENIG, HASL, Chem. Tin/SnSoldermask/Protective FilmPI(0.5mil,1mil,2mil)(Yellow, White, Black)PET(1mil,2mil)Solder mask (green, yellow, black...)SilkscreenRed/Yellow/Black/WhiteCertificateUL, ISO 9001, ISO14001, IATF16949 Special RequestGlue(3M467,3M468,3M9077,TESA8853...)Material SuppilersShengyi, ITEQ, Taiyo, etc.Common PackageVacuum+CartonMonthly production capacity/m²60,000 m² ABIS Flexible PCB Manufacturing Process-Double-side Flex-PCB:Cutting → Drilling → PTH → Electroless Plating → Pretreating → Dry Film Lamination → Position → Exposure → Develop → Pattern Plating → Remove Dry Film → Pretreating → Dry Film Lamination → Position and Exposure → Develop → Etching → Remove Dry Film → Surface Finish → Cover lay Lamination → Lamination → Curing → Immersion Gold → Silkscreen → V-cutting/scoring → Electrical Test → Punching → FQC → Packaging → Shipment-Single-side Flex-PCB:Cutting → Drilling → Dry Film Lamination → Position and Exposure → Develop → Etching → Remove Dry Film → Surface Finish → Coverlay Lamination →Lamination → Curing → Surface Finish → Immersion Gold → Silkscreen → V-cutting/scoring → Electrical Test → Punching → FQC → Packaging → ShipmentLead TimeFlexible PCB Lead Time Small Batch Volum≤1 sq meterWorking DaysMass ProductionWorking DaysSingle-Sided3-4Single-Sided8-102-4 layers4-52-4 layers10-126-8 layers10-126-8 layers14-18  How ABIS Dealing With Flexible PCB Issues?The first thing we ensure is the right equipment to produce your board. Next, the staff experienced enough to handle the challenge of manufacturing flexible boards. Opening a solder mask or overlay enough-different steps of the process might change how a flexible board looks. Etching and plating can adjust the shape of the PCB, which is why you should ensure that overlay openings are of suitable width.Choose the materials carefully, also considering other things, such as size, weight, and reliability of the board.Control appropriate proximity of solder joints and bending point - the solder joint should be at the required distance from the bending location. If you put them too close, delamination or broken solder pad may occur.Control Solder pad spacing - ABIS ensuring there is enough space between the pads and the conductive traces adjacent to them, so that avoiding lamination loss.  Our Advantages Our AdvantagesHigh-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hourHigh efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productionProfessional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III StandardsWe provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.     Quality ControlQuality Control-Advanced equipment listAOI TestingChecks for solder pasteChecks for components down to 0201Checks for missing components, offset, incorrect parts, polarityX-Ray InspectionX-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.Power-up TestAdvanced Function TestFlash Device ProgrammingFunctional testing IOC incoming inspectionSPI solder paste inspectionOnline AOI inspectionSMT first article inspectionExternal assessmentX-RAY-welding inspectionBGA device reworkQA inspectionAnti-static warehousing and shipment-Persue 0% complaint on quality