Enig 5u′′ Rigid Printed Circuit Board Prototyping to Mass Production

Enig 5u'' Rigid Printed Circuit Board Prototyping to Mass Production   Product DescriptionABIS PCBA Projects IntroductionABIS CIRCUITS Company deliver services, not only products. We offer solutions, not only goods.From the PCB production, the components purchasing to the components assemble. Includes:   PCB CustomPCB drawing / design according to your schematic diagramPCB manufacturingComponent sourcingPCB AssemblePCBA 100% test   PCBA Capabilities PCBA Capabilities  1SMT assembly including BGA assembly2Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP3Component height: 0.2-25mm4Min packing: 02045Min distance among BGA : 0.25-2.0mm6Min BGA size: 0.1-0.63mm7Min QFP space: 0.35mm8Min assembly size: (X*Y): 50*30mm9Max assembly size: (X*Y): 350*550mm10Pick-placement precision: ±0.01mm11Placement capability: 0805, 0603, 040212High pin count press fit available13SMT capacity per day: 80,000 pointsCapability - SMT  Lines 9(5 Yamaha,4KME)Capacity52 million placements per monthMax Board Size   457*356mm.(18"X14")Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFPSpeed 0.15 sec/chip,0.7 sec/QFP  Production ProcessesMaterial Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping Our AdvantagesOur AdvantagesHigh-end euipment-high speed Pick and Place Machines that can process about 25,000 SMD components per hourHigh efficient supply ability 60K Sqm monthly-Offers low volume and on-demand PCB production, also large-scale productionProfessional engineering team-40 engineers and their own tooling house, strong at OEM. Offers two easy options: Custom and Standard-In-depth knowledge of IPC Class II and III StandardsWe provide a comprehensive turn-key EMS service to customers who want us to assemble the PCB into PCBA, including prototypes, NPI project, small and medium volume. We are also able to source all components for your PCB assembly project. Our engineers and sourcing team have rich experience in supply chain and EMS industry, with deep knowledges in SMT assembly allowing to resolve all the production issues. Our service is cost-effective, flexible, and reliable. We have satisfied customers across many industries including medical, industrial, automotive and consumer electronics.Quality ControlQuality Control-Advanced equipment LISTAOI TestingChecks for solder pasteChecks for components down to 0201Checks for missing components, offset, incorrect parts, polarityX-Ray InspectionX-Ray provides high-resolution inspection of:BGAs/Micro BGAs/Chip scale packages /Bare boardsIn-Circuit TestingIn-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by component problems.Power-up TestAdvanced Function TestFlash Device ProgrammingFunctional testing IOC incoming inspectionSPI solder paste inspectionOnline AOI inspectionSMT first article inspectionExternal assessmentX-RAY-welding inspectionBGA device reworkQA inspectionAnti-static warehousing and shipment-Persue 0% complaint on qualityAll department implements according to ISO and the related dept has to provide 8D report if any board scrapped to defective.All the outgoing boards have to be 100% electronic tested, impedance tested and soldering.Visual inspected, we make the inspect microsection before shipment.Train the mindset of employees and our enterprise culture, make they happy with their work and our company, it's helpful for them to produce good quality products.High quality raw material (Shengyi FR4, ITEQ, Taiyo Solder Mask Ink etc.)The AOI could inspect the whole set, boards are inspected after each process  PCB Technical & Capability     Production capacity of hot-sale productsDouble Side/Multilayer PCB WorkshopAluminum PCB WorkshopTechnical CapabilityTechnical CapabilityRaw materials: CEM-1, CEM-3, FR-4(High TG), Rogers, TELFONRaw materials: Alurminum base, Copper baseLayer: 1 layer to 32 LayersLayer: 1 layer and 2 LayersMin.line width/space: 3mil/3mil(0.075mm/0.075mm)Min.line width/space: 4mil/4mil(0.1mm/0.1mm)Min.Hole size: 0.1mm(dirilling hole)Min.Hole size: 12mil(0.3mm)Max. Board size: 1200mm* 600mmMax.Board size: 1200mm* 560mm(47in* 22in)Finished board thickness: 0.2mm- 6.0mmFinished board thickness: 0.3~ 5mmCopper foil thickness: 18um~280um(0.5oz~8oz)Copper foil thickness: 35um~210um(1oz~6oz)NPTH Hole Tolerance: +/-0.075mm, PTH hole Tolerance: +/-0.05mmHole position tolerance: +/-0.05mmOutline Tolerance: +/-0.13mmRouting outline tolerance: +/ 0.15mm; punching outline tolerance:+/ 0.1mmSurface finished: Lead free HASL, immersion gold(ENIG), immersion silver, OSP, gold plating, gold finger, Carbon INK.Surface finished: Lead free H