Description Fifth Generation HEXFET® Power MOSFETs from
International Rectifier utilize advanced processing techniques to
achieve extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized device design
that HEXFET power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a wide
variety of applications. The D2Pak is a surface mount power package
capable of accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-resistance in
any existing surface mount package. The D2Pak is suitable for high
current applications because of its low internal connection
resistance and can dissipate up to 2.0W in a typical surface mount
application. The through-hole version (IRF9530NL) is available for
lowprofile applications. Mfr Infineon Technologies Series
HEXFET® Package Tape & Reel (TR) Product Status Active
FET Type P-Channel Technology MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 100 V Current -
Continuous Drain (Id) @ 25°C 14A (Tc) Drive Voltage (Max Rds
On, Min Rds On) 10V Rds On (Max) @ Id, Vgs 200mOhm @ 8.4A,
10V Vgs(th) (Max) @ Id 4V @ 250µA Gate Charge (Qg)
(Max) @ Vgs 58 nC @ 10 V Vgs (Max) ±20V Input
Capacitance (Ciss) (Max) @ Vds 760 pF @ 25 V FET Feature -
Power Dissipation (Max) 3.8W (Ta), 79W (Tc) Operating
Temperature -55°C ~ 175°C (TJ) Mounting Type Surface Mount
Supplier Device Package D2PAK Shenzhen Airuixin
Technology Co., Ltd., as a professional ICs supplier of Brand IC,
we promise the Original quality and fast delivery.The hot brand:
MICROCHIP, INFINEON, DEGSON,TI,ON,MAXIM,ST,OMRON,TOSHIBA,LELON and
so on .Beside, we deal with kinds of ICs like
Capacitors/Connectors/Diodes & Transistors/ICs Analog &Mixed
Signal ICs/Digital Cards & Modules/Relays &
Keyboards/Sensors/Switches/Test &Measurements etc in best
quality. /* January 22, 2024 19:08:37 */!function(){function
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